Toshiba has launched “TCK207AN,” a compact load switch IC with an increased strength package.
The DFN4A package is a newly developed, compact mold resin package. Its higher strength package compared with the conventional WCSPmakes it harder for the product to be damaged by contact or impact when or after being mounted on a board. In addition, its low On-resistance and low current consumption contribute to the lower power consumption of devices.
Datasheet
https://toshiba.semicon-storage.com/info/docget.jsp?did=63537&prodName=TCK207AN
for more details
https://toshiba.semicon-storage.com/ap-en/company/news/new-products-share/linear/linear-20190328-1d.html
The DFN4A package is a newly developed, compact mold resin package. Its higher strength package compared with the conventional WCSPmakes it harder for the product to be damaged by contact or impact when or after being mounted on a board. In addition, its low On-resistance and low current consumption contribute to the lower power consumption of devices.
Datasheet
https://toshiba.semicon-storage.com/info/docget.jsp?did=63537&prodName=TCK207AN
for more details
https://toshiba.semicon-storage.com/ap-en/company/news/new-products-share/linear/linear-20190328-1d.html
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